FIELD: electrical engineering.
SUBSTANCE: invention relates to electrical engineering, particularly, to structural material designed to reduce reflection of SHF electromagnetic waves. Proposed material represents a flat package sandwiched outer structural layer, conducting layer, matching dielectric layer and metal screen. Conducting layer is arranged between structural and matching dielectric layer, while metal screen is arranged on the opposite side of aforesaid matching layer. Invention claims comprises formulae to calculate relative surface conductance of conducting layer, thickness and relative dielectric conductance of the said dielectric layer, and those to calculate maximum overlap of operating wavelength range. Proposed material can be used for masking objects operated at higher air pressures and/or higher temperatures.
EFFECT: structural material absorbing electromagnetic radiation.
4 cl, 1 dwg, 1 ex
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Authors
Dates
2009-09-10—Published
2007-02-19—Filed