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2 367 552

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(51)

IPC

B23K35/28(2006-01-01)

C22C5/08(2006-01-01)

(21) (22)

Application

2008117503/02, 2008-04-30

(24)

Start date

2008-04-30

(22)

Actual filing date

2008-04-30

(45)

Published

2009-09-20

(72)

Inventor

Dovzhenko Nikolaj NikolaevichSidel'Nikov Sergej BorisovichBiront Vitalij SemenovichBeljaev Sergej VladimirovichUskov Igor' Vasil'EvichStoljarov Aleksandr ValentinovichVinogradov Oleg OlegovichLebedeva Ol'Ga Sergeevna

(73)

Holder

Federal'Noe Gosudarstvennoe Obrazovatel'Noe Uchrezhdenie Vysshego Professional'Nogo Obrazovanija Federal'Nyj Universitet"

SOLDER ALLOY ON BASIS OF SILVER Russian patent published in 2009 - IPC B23K35/28 C22C5/08

Abstract RU 2367552 C1

FIELD: metallurgy.

SUBSTANCE: solder alloy can be used in jewellery industry, electronics, electrotechnics and instrument engineering. Solder alloy contains components in a following ratio, wt %: silver 39-41; copper 30-35; zinc 22-26; indium 1-3; tin 1-2. Alloy of solder alloy allows wide range of strength limit 390-530 MPa. Introduction of tin provides receiving of solder alloy in the form of powder with wide range of size composition 50-315 micrometre. Combinations of indium and tin are almost harmless for man body.

EFFECT: decreasing of problems at manufacturing and usage of solder alloy at manufacturing and expansion of manufacturing capabilities of application of particular solder alloy.

2 tbl

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RU 2 367 552 C1

Authors

Dovzhenko Nikolaj Nikolaevich

Sidel'Nikov Sergej Borisovich

Biront Vitalij Semenovich

Beljaev Sergej Vladimirovich

Uskov Igor' Vasil'Evich

Stoljarov Aleksandr Valentinovich

Vinogradov Oleg Olegovich

Lebedeva Ol'Ga Sergeevna

Dates

2009-09-20—Published

2008-04-30—Filed