FIELD: metallurgy.
SUBSTANCE: solder contains components at a following combinations, wt % : silver 39-41; copper 34-36; zinc 14-16; indium 9-11.
EFFECT: upgraded of production safety; expanding process capabilities and reduction of problems at fabricating and application of given solder in production.
2 tbl
Title | Year | Author | Number |
---|---|---|---|
SOLDER ALLOYS ON BASIS OF SILVER | 2008 |
|
RU2367553C1 |
SOLDER ALLOY ON BASIS OF SILVER | 2008 |
|
RU2367552C1 |
SILVER-BASE SOLDER | 2012 |
|
RU2496625C1 |
SOLDER FOR SOLDERING METALS AND STEELS | 0 |
|
SU1763133A1 |
SOLDER FOR PALLADIUM AND ITS ALLOYS | 2000 |
|
RU2176180C1 |
JEWELRY ALLOY BASED ON HALLMARK 585 GOLD | 1999 |
|
RU2170280C1 |
SOLDER FOR LOW-TEMPERATURE SOLDERING | 2002 |
|
RU2219030C1 |
SOLDER FOR SOLDERING DENTAL PROSTHESES | 2001 |
|
RU2183447C1 |
LOW-TEMPERATURE SOLDER FOR SOLDERING | 0 |
|
SU1440652A1 |
SOLDER | 0 |
|
SU1706816A1 |
Authors
Dates
2008-10-10—Published
2006-12-25—Filed