SOLDER ALLOYS ON BASIS OF SILVER Russian patent published in 2009 - IPC B23K35/28 C22C5/08 

Abstract RU 2367553 C1

FIELD: metallurgy.

SUBSTANCE: solder alloy can be used in jewellery industry, electronics, electrical engineering and instrument engineering. Solder alloy contains components in a following ratio, wt %: silver 39-41, copper 34-36, zinc 19-21, indium 4-6. Compounds of indium are virtually harmless for human's body.

EFFECT: decreasing of problems at manufacturing and application of particular solder alloy at manufacturing and expanding of manufacturing capabilities of application of particular solder alloy.

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RU 2 367 553 C1

Authors

Dovzhenko Nikolaj Nikolaevich

Sidel'Nikov Sergej Borisovich

Biront Vitalij Semenovich

Beljaev Sergej Vladimirovich

Uskov Igor' Vasil'Evich

Stoljarov Aleksandr Valentinovich

Vinogradov Oleg Olegovich

Lebedeva Ol'Ga Sergeevna

Dates

2009-09-20Published

2008-04-30Filed