FIELD: metallurgy.
SUBSTANCE: solder alloy can be used in jewellery industry, electronics, electrical engineering and instrument engineering. Solder alloy contains components in a following ratio, wt %: silver 39-41, copper 34-36, zinc 19-21, indium 4-6. Compounds of indium are virtually harmless for human's body.
EFFECT: decreasing of problems at manufacturing and application of particular solder alloy at manufacturing and expanding of manufacturing capabilities of application of particular solder alloy.
2 tbl
Title | Year | Author | Number |
---|---|---|---|
SOLDER ALLOY ON BASIS OF SILVER | 2008 |
|
RU2367552C1 |
SOLDER ON SILVER BASE | 2006 |
|
RU2335385C1 |
SILVER-BASE SOLDER | 2012 |
|
RU2496625C1 |
SOLDER FOR SOLDERING METALS AND STEELS | 0 |
|
SU1763133A1 |
LEAD BASED SOLDER | 2013 |
|
RU2547979C1 |
SOLDER FOR PALLADIUM AND ITS ALLOYS | 2000 |
|
RU2176180C1 |
LOW-TEMPERATURE SOLDER FOR SOLDERING | 0 |
|
SU1440652A1 |
SOLDER FOR LOW-TEMPERATURE SOLDERING | 2002 |
|
RU2219030C1 |
SOLDER FOR SOLDERING DENTAL PROSTHESES | 2001 |
|
RU2183447C1 |
SOLDER FOR SOLDERING DENTAL PROSTHESES | 0 |
|
SU596402A1 |
Authors
Dates
2009-09-20—Published
2008-04-30—Filed