FIELD: processes and tools for soldering different designation articles, namely sealing module cases in microelectronics.
SUBSTANCE: soft solder may be in the form of wire, strip or foil and it contains components at next relation, mass %: indium, 48 -52; tin, 46 -50; gallium, 0.6 - 2.0; zinc, 0.6 - 2.0. Relation of gallium content to that of tin and zinc content to that of tin is in range 1/75 - 1/25. Solder provides ultimate strength of soldered articles at low temperature soldering.
EFFECT: increased strength of soldered joints at their high capability for deformation.
1 tbl, 6 ex
| Title | Year | Author | Number |
|---|---|---|---|
| SOLDER METAL FOR SOLDERING | 2008 |
|
RU2374056C1 |
| SOLDER FOR SOLDERING OIL AND GAS FIELD EQUIPMENT | 1994 |
|
RU2070496C1 |
| SOLDER FOR FLUXLESS TINNING OF ALLOYS TERBIUM-IRON | 0 |
|
SU1590295A1 |
| FLUX FOR SOLDERING HARD-ALLOY SOLDER ONTO SURFACE OF TOOL STEEL | 2004 |
|
RU2262430C1 |
| PROCESS OF OBTAINING QUICK-RESISTANT BORON-FREE SOLDER NICKEL BRAZING PRODUCTS FROM CORROSIVE-STEEL, SOLDER, PEAK CONNECTION AND METHOD OF ITS OBTAINING | 2015 |
|
RU2625924C2 |
| SOLDER FOR SOLDERING MAINLY COPPER AND COPPER-BASED ALLOYS | 1993 |
|
RU2041783C1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2004 |
|
RU2263569C1 |
| ALLOY SOLDER FOR SOLDERING STAINLESS STEELS AND NICKEL-BASED ALLOYS | 1993 |
|
RU2096150C1 |
| SOLDER FOR FLUXLESS SOLDERING | 2010 |
|
RU2432242C1 |
| SOLDER ALLOY ON BASIS OF SILVER | 2008 |
|
RU2367552C1 |
