FIELD: technological processes.
SUBSTANCE: this invention is related to the field of soldering, in particular to methods for soldering of parts made of stainless steel and may find application in machine building. Prior to assembly of parts, nickel coating is applied onto their soldered surfaces, and two annular bores are arranged on external surface of nozzle, where solder is placed. Internal diametre of cylindrical bush in area of soldered seam is arranged as less then required diametre. Assembled structure is placed into container, where reservoir with titanium chip is placed, and at the temperature of 200-300°C, analysis of protective medium is carried out for availability of oxygen-containing gases in it. After required purity of protective gas is achieved in container, structure is heated up to temperature of solder melting, and structure cooling is started without time delay. Then it is withdrawn from container, and internal diametre of cylindrical bush is bored to required diametre, cutting the first annular bore at the same time.
EFFECT: production of high-quality soldered joint without gas bubbles and defects.
6 cl, 1 ex, 3 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD OF MANUFACTURE OF VALVE MADE OF HIGH-ALLOY STEEL OF TRANSITION CLASS | 2004 |
|
RU2330747C2 |
METHOD OF SOLDERING SOLDERED-WELDED STRUCTURES WITH TELESCOPIC JOINTS | 0 |
|
SU1808554A1 |
METHOD OF LOW TEMPERATURE SOLDERING OF THIN-WALL CYLINDRICAL TITANIUM AND STEEL PARTS | 2010 |
|
RU2443521C1 |
METHODS OF PRODUCTING DIMENSIONED DOUBLE-LAYER CONSTRUCTIONS FROM VARIOUS MATERIALS (VARIANTS) | 2005 |
|
RU2323808C2 |
TELESCOPIC STRUCTURE SOLDERING METHOD | 1998 |
|
RU2156182C2 |
METHOD FOR SOLDERING TELESCOPIC CONSTRUCTIONS | 2001 |
|
RU2221679C2 |
PROCESS OF OBTAINING QUICK-RESISTANT BORON-FREE SOLDER NICKEL BRAZING PRODUCTS FROM CORROSIVE-STEEL, SOLDER, PEAK CONNECTION AND METHOD OF ITS OBTAINING | 2015 |
|
RU2625924C2 |
BRAZING METHOD | 1995 |
|
RU2104840C1 |
METHOD OF BRAZING OF TWO LAYER ARTICLES | 1995 |
|
RU2104838C1 |
NICKEL-BASED SOLDER ALLOY | 1996 |
|
RU2115528C1 |
Authors
Dates
2009-12-10—Published
2006-05-05—Filed