HEAT-RESISTANT THIN-FILM STRAIN PRESSURE SENSOR Russian patent published in 2009 - IPC G01L9/04 

FIELD: instrumentation.

SUBSTANCE: invention refers to the field of instrumentation and can be used for pressure measuring in conditions of measured medium non-steady temperatures (thermal shock) action. Heat-resistant thin-film strain pressure sensor contains diaphragm where resistance strain gages are installed along circular arc and in radial direction. These strain gages are included into metering bridge. Strain gages installed in circumferential direction are made consisting of several parts in the form of circular arcs of equal lengths. Each of the arcs is located along circumference with radius equal to Inner radii of subsequent from the diaphragm centre parts of circumferential strain gages coincide with outer radii of previous circumferential strain gages. In this structure components of circumferential strain gages by their inner radius are located along circumference with radius of by their outer radius - along circumference with radius of Outer radius of the last part of circumferential strain gage coincides with radius r₂ of the circumference along which the end of each component of radial strain gage is located.

EFFECT: increase in accuracy of pressure measuring in conditions of thermal shock action while keeping sensitivity.

9 dwg