FIELD: chemistry.
SUBSTANCE: invention relates to a thermosetting resin composition for protective coating semiconductor devices from the effect of the environment. The composition contains epoxy resin - ED-20, filler, polymerisation catalyst - boron compound and a mixture of mono-, di- and polysulphides of 2-tert-butylphenol having the structure:
n=1÷4
in amount of 2.4-4.0% of the mass of the epoxy resin. Proposed also is a method of making a protective coating for semiconductor devices.
EFFECT: invention enables protection of semiconductor articles and microcircuit chips from external effects, including radiation exposure.
2 cl, 2 ex, 2 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| COMPOUND | 2005 |
|
RU2293099C1 |
| ABRASION-RESISTANT PROTECTIVE POLYMERIC COMPOSITION | 2004 |
|
RU2261879C1 |
| PRIMER COMPOSITION FOR PROTECTING STEEL SURFACES FROM CORROSION | 2019 |
|
RU2716069C1 |
| EPOXIDE COMPOSITION | 2003 |
|
RU2283333C2 |
| COMPOSITION BASED ON A LINEAR-LADDER SILOXANE BLOCK-COPOLYMER FOR PRODUCING PROTECTIVE COATINGS | 2020 |
|
RU2727373C1 |
| PROTECTIVE COATING COMPOSITION | 2011 |
|
RU2480499C2 |
| RAW MIXTURE (VARIANTS), METHOD FOR PREPARING HIGH-FILLED COMPOSITION MATERIAL AND METHOD FOR MAKING ARTICLE FROM ITS | 2004 |
|
RU2269497C1 |
| TWO-COMPONENT PRIMING COMPOSITION | 2002 |
|
RU2216562C1 |
| EPOXY POURING COMPOUND | 1992 |
|
RU2036948C1 |
| POLYMERIC COMPOSITION | 1993 |
|
RU2054022C1 |
