FIELD: process engineering.
SUBSTANCE: invention may be used in producing electronic hardware power modules. Conduction heating of heater marmite is performed to create liquid phase of solder between heat-sink base and microstrip p.c.b. Both are pressed together smoothly to increase pressure area from center to edges under atmospheric pressure and with smooth adjustment of vacuum in working zone. Solder crystallisation temperature reached, vacuum level in working chamber is decreased smoothly to atmospheric pressure. Device vacuum chamber is formed by detachable cover consisting of the frame tightly closed by elastic film and trough provided with vacuum suction channels. Detachable cover is jointed to trough by sealer and back-folding appliances of the frame clamping.
EFFECT: higher intensity of heat transfer through soldered joint from high-power radio components to heat-sink base.
14 cl, 3 dwg, 1 ex
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