WIRING BOARD FOR ELECTRONIC COMPONENT Russian patent published in 2011 - IPC H05K1/18 H05K1/11 

FIELD: construction.

SUBSTANCE: when using such a mounting panel for an electronic component, which excludes usage of an ordinary connector as an external connecting lead, it is possible to improve reliability and to prolong service life, and also to reduce dimensions and thickness. The wiring board for the electronic component in accordance with this invention comprises the following parts: a properly heat-dissipating substrate, comprising a metal plate and a circuit wiring formed on the upper surface of the metal plate; an electronic component, which is installed on the properly heat-dissipating substrate and is electrically connected to the circuit wiring; and a lead for external connection, which is arranged on the properly heat-dissipating substrate and ensures electric connection between the wiring board for the electronic component and the external device. The lead for external connection is formed of material having lower heat conductivity compared to heat conductivity of the metal plate, and has at least one external electrode, to which a wire lead is soldered.

EFFECT: development of a wiring board for an electronic component, having an outer connecting lead, to which a wire lead may be directly soldered.

11 cl, 7 dwg