FIELD: instrument making.
SUBSTANCE: barrier coating that prevents diffusion of solder materials and contact plates into a semiconductor material is applied onto surfaces of thermoelectric module branches coupled with contact plates. The coating is applied by method of vacuum spraying from separated electric arc plasma after plasma-chemical etching in a single process cycle without vacuum disturbance in a process chamber. Also application of adhesive coating is provided above the barrier one in a single process cycle, which is necessary to improve solderability of semiconductor thermoelectric branches.
EFFECT: thermoelectric module reliability improvement and service life extension.
3 cl, 3 dwg
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