DEVICE FOR TEMPERATURE STABILISATION OF CHIP ASSEMBLY ELEMENTS Russian patent published in 2012 - IPC H01L23/36 

FIELD: electricity.

SUBSTANCE: device for temperature stabilisation of chip assembly elements contains conductor; dielectric rectangular substrate with strip film heater located at its operators side along longitudinal axis and the first termination of heater is connected to conductor; two rectangular areas for installation of chip assembly elements limited by substrate edges and four lines applied to this surface, which differ visually from other elements on substrate surface; temperature sensor installed near substrate edge at transversal axis of its working area, temperature-control circuit connected by common conductor, blocking capacitor; at backside of substrate there's metal layer symmetrical to its longitudinal axis, its length is equal to length of substrate and width varies within 1.00-1.05 of distance between lines applied to work side of substrate and the metal layer is connected with common conductor at point located at longitudinal axis of substrate side close to the second termination of heater.

EFFECT: functionality enhancement for thermostat devices operating in broad band of frequencies.

11 dwg