DEVICE TO STABILISE TEMPERATURE OF MICROASSEMBLIES Russian patent published in 2012 - IPC G05D23/00 

FIELD: electricity.

SUBSTANCE: in a device to stabilise temperature of microassemblies, comprising a common conductor, a rectangular dielectric plate, on the working surface of which along its longitudinal axis there is a strip film heater, symmetrically to the heater there are two rectangular sections to locate microassembly components on them, and on the transverse axis of the working surface of the plate near its edge - a temperature sensor, and also a temperature control circuit and a blocking capacitor, on a part of the rear surface of the dielectric plate along its entire length there is a metal layer applied, elements of microassemblies are poured with a dielectric compound, the first and second versions of the device additionally include two metal bars of rectangular section, length of which is equal to the length of the dielectric plate, and which are located at both sides of the strip film heater and are connected mechanically by their bases with the working surface of the dielectric plate, the second rectangular dielectric plate, the length of which is equal to the length of the first plate, and width - to the distance between the bars, on the entire rear surface of the second plate there is a metal layer applied, and on its working surface there are two sections, where microassembly elements are located, filled with the dielectric compound, similar to the two sections of the first plate, the second dielectric plate is located between the metal bars. At the same time the layers containing elements of microassemblies of the second plate contact layers containing elements of microassemblies of the first plate. The second version of the device differs from the first version by the fact that it additionally comprises the third rectangular dielectric plate, dimensions of which are equal to dimensions of the second plate, and as the working surface of which one of its initial surfaces is used, and as the rear one - another surface coated with a metal layer, on the working surface of the third plate there are microassembly components filled with the dielectric compound, the third plate is also located between the bars, at the same time the layer containing elements of third plate microassemblies contacts the metal layer of the second plate.

EFFECT: increased area to locate temperature-controlled elements of microassemblies without increase of length and width of a device for stabilisation of microassembly temperature.

2 cl, 27 dwg