INTERFACIAL CONNECTION FOR INTEGRATED CIRCUITS AND METHOD OF ITS MANUFACTURING Russian patent published in 2012 - IPC H05K3/00 

Abstract RU 2439866 C2

FIELD: electricity.

SUBSTANCE: interfacial connection for composite boards contact pads have elements crossing (in plane) hole in dielectric between them or elements crossing hole in dielectric and their surfaces are connected electrically face to face. Method of interfacial connection is suggested when one of connected contact pads is made in the form of window or in the form of conductive elements crossing window, dielectric within frames of window, including space under elements crossing window; such contact pad is removed and elements of contacts pads are connected electrically.

EFFECT: reduction of electric resistance and improvement of connection reliability.

22 cl

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RU 2 439 866 C2

Authors

Abduev Marat Khadzhi-Muratovich

Djatlov Vladimir Mikhajlovich

Djatlov Mikhail Vladimirovich

Nikulin Jurij Grigor'Evich

Savina Elena Vladimirovna

Dates

2012-01-10Published

2009-12-29Filed