MULTILAYER SWITCHING BOARD OF MICROWAVE-HYBRID INTEGRATED MICROCIRCUIT OF SPACE DESIGNATION AND METHOD FOR ITS PRODUCTION (VERSIONS) Russian patent published in 2020 - IPC H05K3/46 H05K3/42 H01L21/00 H01L23/00 

FIELD: electronic equipment.

SUBSTANCE: invention relates to electronic engineering, specifically to microwave microelectronics. Multilayer switching board of UHF hybrid integrated microcircuit for spacecraft comprises dielectric substrate accommodating N alternating metal and dielectric layers with topological pattern, active elements arranged on a substrate and/or on a dielectric layer with mounting pads, interlayer switching is performed by means of electrically insulated conductive element in dielectric layer and/or in/on dielectric substrate made on the basis of gold in the form of microminiature anchor with formation of expansion-cups partially located outside the hole.

EFFECT: high adhesion strength of wiring connections in a circuit board and manufacturability of a switching microwave board.

12 cl, 9 dwg