INTEGRATED CIRCUIT PACKAGE Russian patent published in 2010 - IPC H01L23/02 

FIELD: electricity.

SUBSTANCE: in integrated circuit package containing multi-layer base with matrix of ball leads and integral circuit, heat sink, cover and radiator, which are located on it, the cover is made in the form of thin-wall corrugated plate, and thickness of heat sink fixed on integral circuit exceeds the distance between inner surfaces of cover and integral circuit by value Δh, which provides constant thermal contact of cover and heat sink in conditions of impact loads within the range of accelerations of 0 to 100 g, which can be determined by the proposed formula, depending on impact acceleration and natural frequency.

EFFECT: improving heat-dissipating characteristics of housing, operating reliability in conditions of high temperature drops and high linear loads.

2 dwg