BODY OF INTEGRATED CIRCUIT Russian patent published in 2010 - IPC H01L23/10 

FIELD: electric engineering.

SUBSTANCE: in body of integral circuit, comprising ceramic base with multilayer conducting structure and matrix of ball leads, having a mount hole in the centre for location of integrated circuit, commutation insert and heat sink, commutation insert and heat sink are combined and arranged in the form of single switching heat sink - plates of aluminium nitride, on face inner and outer surfaces of which there are contact platforms and ball leads arranged accordingly, electrically connected to each other by means of through metallised conductors, at the same time ball leads of base and switching heat sink are installed in one plane, and switching heat sink is connected to base of body by means of soldered metal frame.

EFFECT: increased number of outer leads with the same dimensions of body and provision of efficient heat removal from zone of integrated circuit location.

2 dwg