ADHESIVE COMPOSITION Russian patent published in 2012 - IPC C09K3/10 C09J163/00 C09J163/02 C09J163/10 

Abstract RU 2468055 C1

FIELD: chemistry.

SUBSTANCE: invention relates to epoxy resin-based adhesives and can be used to obtain a heat-conducting adhesive compound for gluing and sealing components made from glass, ceramic and metal, including aluminium alloys. The adhesive composition consists of the following, in pts.wt: modified K-139 epoxy resin 594-596, UP-0633M amine curing agent 88-90, boron nitride 296-300 and chromium (III) oxide 16-20.

EFFECT: obtaining an adhesive joint with improved physical and technical properties.

1 cl, 2 tbl

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RU 2 468 055 C1

Authors

Chinchevich Valentina Vasil'Evna

Altukhova Marina Anatol'Evna

Burmistrova Anna Alekseevna

Dates

2012-11-27Published

2011-08-30Filed