FIELD: chemistry.
SUBSTANCE: invention relates to epoxy resin-based adhesives and can be used to obtain a heat-conducting adhesive compound for gluing and sealing components made from glass, ceramic and metal, including aluminium alloys. The adhesive composition consists of the following, in pts.wt: modified K-139 epoxy resin 594-596, UP-0633M amine curing agent 88-90, boron nitride 296-300 and chromium (III) oxide 16-20.
EFFECT: obtaining an adhesive joint with improved physical and technical properties.
1 cl, 2 tbl
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Authors
Dates
2012-11-27—Published
2011-08-30—Filed