FIELD: metallurgy.
SUBSTANCE: method involves anodic oxidation in water solution containing orthophosphoric and sulphuric acids, application of coating by electric precipitation from sulphate coppering electrolyte; at that, anodic oxidation is performed at anodic current density of 1-2 A/dm2, and prior to application of coating by electric precipitation, interlayer from the solution with the following component ratio is applied, g/l: 5-aqueous copper sulphate 200-250, sulphuric acid 50-70, hydrofluoric acid 10-15, water is the rest, during 2-3 minutes at room temperature and cathodic current density of 1-2 A/dm2.
EFFECT: reduction of power consumption at high quality of the coating.
1 tbl, 3 ex
| Title | Year | Author | Number | 
|---|---|---|---|
| ELECTROLYTE FOR ANODISING AND COPPER COATING OF ALUMINIUM AND ALLOYS THEREOF | 2014 | 
 | RU2588702C2 | 
| ELECTROLYTE FOR ANODE TREATMENT OF ALUMINIUM AND ALLOYS THEREOF BEFORE COPPER PLATING | 2013 | 
 | RU2529328C1 | 
| ELECTROLYTE FOR COPPER PLATING OF ANODIZED ALUMINUM AND ITS ALLOYS | 2022 | 
 | RU2784143C1 | 
| METHOD OF GALVANIC METALIZATION OF MOLYBDENUM ALLOYS | 2017 | 
 | RU2653515C1 | 
| METHOD FOR APPLICATION OF NICKEL COATINGS TO ALUMINUM ALLOYS | 2017 | 
 | RU2661695C1 | 
| METHOD OF APPLYING ELECTROCONDUCTIVE PROTECTIVE COATING ON ALUMINIUM ALLOYS | 2023 | 
 | RU2817277C1 | 
| METHOD OF SURFACE PREPARATION OF STAINLESS STEEL ITEMS PRIOR TO GALVANIC COPPERPLATING | 2013 | 
 | RU2549037C2 | 
| ELECTROLYTE AND METHOD OF COPPER SEDIMENTATION ON THIN CONDUCTIVE SUBLAYER ON SURFACE OF SILICIC PLATES | 2012 | 
 | RU2510631C1 | 
| COMPOSITION FOR ELECTROCHEMICAL COPPER PLATING OF THROUGH HOLES OF PRINTED CIRCUIT BOARDS | 2023 | 
 | RU2817024C1 | 
| PROCESS OF DEPOSITION OF METAL COATS ON ARTICLES MADE OF MAGNESIUM AND ITS ALLOYS | 1999 | 
 | RU2150534C1 | 
Authors
Dates
2012-12-27—Published
2011-11-15—Filed