FIELD: process engineering.
SUBSTANCE: invention relates to abrasive processing and may be used in making micro- and optoelectronics for one-sided processing, mainly, be grinding of glass, ceramic, quartz etc plates. Proposed device comprises abrasive table with drive and self-adjusting spindle with drive articulated therewith. Said spindle is composed of face-plate with working plate fixation zones. Abrasive table is composed of face-plate with annular zone of diamond-abrasive tools secured thereon. Plate fixation zone is made of material with micro holes or pores for vacuum feed via spindle drive. Said holes are provided with vacuum-tight sleeves on one side and, on the other side, with vacuum-tight collet holder with vacuum hose.
EFFECT: higher efficiency and quality.
2 cl, 3 dwg, 1 tbl
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