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(19)

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2 496 286

(13)

(51)

IPC

H05K3/18(2006-01-01)

(21) (22)

Application

2012110512/07, 2012-03-20

(24)

Start date

2012-03-20

(22)

Actual filing date

2012-03-20

(45)

Published

2013-10-20

(72)

Inventor

Sasov Jurij DmitrievichUsachev Vadim AleksandrovichGolov Nikolaj AleksandrovichKudrjavtseva Natal'Ja Valer'Evna

(73)

Holder

Federal'Noe Gosudarstvennoe Bjudzhetnoe Obrazovatel'Noe Uchrezhdenie Vysshego Professional'Nogo Obrazovanija Gosudarstvennyj Tekhnicheskij Universitet Imeni N.Eh. Baumana Im. N.Eh. Baumana)

MANUFACTURING METHOD OF FLEXIBLE RELIEF PRINTED-CIRCUIT BOARDS FOR ELECTRONIC AND ELECTROTECHNICAL EQUIPMENT Russian patent published in 2013 - IPC H05K3/18

Abstract RU 2496286 C1

FIELD: electricity.

SUBSTANCE: relief is applied onto thermoplastic material on two opposite sides, one of which is mirror reflection of the shaped profile. Separate parts of die mould in combination with free masks are used as provision of required stiffness when performing operations of cleaning, activation of surface of base and application of conductors. This invention allows creating electronic and electrotechnical products with high operating properties.

EFFECT: creation of manufacturing method of relief printed-circuit board on maximum thin and flexible insulation base, which has considerably smaller weight and dimensions in comparison to conventional relief printed-circuit boards.

5 cl, 5 dwg

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RU 2 496 286 C1

Authors

Sasov Jurij Dmitrievich

Usachev Vadim Aleksandrovich

Golov Nikolaj Aleksandrovich

Kudrjavtseva Natal'Ja Valer'Evna

Dates

2013-10-20—Published

2012-03-20—Filed