FIELD: electricity.
SUBSTANCE: PbS-based photoreceiving module represents a hybrid microassembly consisting of a photosensitive cell as a PbS-based line and a LSI chip (multiplexor) interconnected as a flip-chip assembly. Indium plugs are applied on lamellar bond areas of the photosensitive cell, which, besides Cr, Pd and Au layers, contain Cr and In sublayers and join indium plugs applied to the LSI chip thus forming electrical and mechanical bonds. The method for manufacture of the photoreceiving cell allows significant reduction in labour intensity of the assembly and increase in manufacturing efficiency using the method of grouped cold welding.
EFFECT: possible design of the photoreceiving cell as a hybrid microassembly and location of LSI chips at the photosensitive cell, reduction of dimensions and improvement of reliability.
3 dwg
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Authors
Dates
2014-05-20—Published
2012-11-07—Filed