FIELD: chemistry.
SUBSTANCE: invention relates to technology of obtaining indium microcontacts for connection of large integrated circuits (LIC) and photodiode matrices, made on the base of semi-conductor materials. Method for manufacturing indium microcontacts according to invention includes spraying indium layer on semi-conductor plates with contact sites, formation of flat indium sites with width of sprayed indium by methods of photolithography and/or ionic etching, and before connection of matrix and LIC flashing of indium flat sites into truncated spheres is carried out by high-frequency cathode etching with ions of inert gas under partial pressure (8-10)P10-1 Pa and power density in charge from 1 W/cm2, without the following heating.
EFFECT: increase of reliability with simultaneous reduction of indium consumption with application of standard construction of evaporator, reduction of time of ionic etching process of spayed indium layer.
1 ex, 1 tbl, 1 dwg
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Authors
Dates
2015-12-20—Published
2014-10-20—Filed