FIELD: chemistry.
SUBSTANCE: silicon carbide is obtained by displacement of a carbon foil tape in a horizontal plane with supply to its surface of melted silicon, the process being performed in dynamic vacuum, rate of displacement being specified within the range of 0.5-3.0 m/min, which results in formation of microcrystals of semiconductor silicon carbide of a cubical structure in the form of a self-bound layer. The said crystals are bound with thin interlayers of excessive silicon, supplied from a feeder. After extraction of the tape with the grown layer, it is cut into measured strips, which are placed in furnaces and heated in air to a temperature of 1050°C for 8 hours.
EFFECT: substrate from the carbon foil is removed, and silicon interlayers, binding SiC crystals are converted into its dioxide, mutually insulating the said crystals electrically, which makes it possible to use such material at higher temperatures.
2 dwg, 7 ex
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Authors
Dates
2014-06-27—Published
2013-02-12—Filed