THERMOELECTRIC COOLING MODULE Russian patent published in 2014 - IPC H01L35/28 

FIELD: metallurgy.

SUBSTANCE: thermoelectric cooling module (TECM) includes cold and hot substrates with a matrix unit of thermoelectric elements, which is arranged between them and includes multiple semiconductor branches of n- and p-types of conductivity, which are connected in pairs by switching buses to an electric circuit. Between the cold substrate and the cold side of the matrix unit an arrangement is made for an elastic heat-conducting device for the connection of switching buses of cold junctions of the thermoelements to the cold substrate. Between the hot substrate and the hot side of the matrix unit an arrangement is made for a device for the connection of switching buses of hot junctions of the thermoelements to the hot substrate. TECM is provided with silicone primers, each of which is made in the form of a flattened four-sided pyramid and attached with its lower base to a free surface of each switching bus of all the cold junctions of the thermoelements. TECM is equipped with an adhesive element for the cold junctions, which is made in the form of an elastic heat-conducting microrelief film repeating the microrelief of the inner surface of the cold substrate and fixed on it. The connection device of the switching buses of the cold junctions of the thermoelements to the cold substrate is made in the form of a protector with a relief pattern arranged on the inner surface of the cold substrate above its adhesive element. The relief pattern of the protector is made in the form of alternating projections having a shape of flattened four-sided pyramids. To each smaller base of the pyramids of the protector there connected is the silicone primer on the corresponding switching bus on the cold side of the matrix unit of the thermoelements with a possibility of formation inside each pyramid of pits for the arrangement in them of the corresponding switching buses. The connection device of the switching buses of hot junctions of the thermoelements to the hot substrate is made in the form of a matrix of adhesive elements, each of which is made in the form of a flattened four-sided pyramid from a conducting material resistant to oxidation, for example silver. The above pyramids of the matrix of adhesive elements are fixed with their larger bases on the inner surface of the hot substrate in pairs. Each pair of the above pyramids of the matrix of adhesive elements is connected with its lower bases to the corresponding switching bus of the hot side of the matrix unit of the thermoelectric elements.

EFFECT: increasing the strength, improving reliability, endurance, providing the stable reception of design output parameters, a long failure-free operating life at operation under severe extreme conditions.

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