THERMOELECTRIC COOLING MODULE Russian patent published in 1998 - IPC

FIELD: thermoelectric devices primarily used under multiple thermal cycling conditions. SUBSTANCE: module has semiconductor circuits of n and p polarities of conductivity interconnected by switching buses. Each switching bus mounted on at least one heat-transfer plate is connected to the latter by means of thermal contact joint made of layer of flexible adhesive compound. Use may be made, for example, of high-heat conducting silicone resin, grade RTV, compound-8 layer thickness is to be better chosen between 5 and 30 mcm. EFFECT: improved cooling efficiency of module. 5 cl, 5 dwg