METAL COATING COMPOSITION CONTAINING SUPPRESSING AGENT FOR VOID-FREE FILLING OF SUBMICRON SURFACE ELEMENTS Russian patent published in 2015 - IPC C25D3/38 

FIELD: chemistry.

SUBSTANCE: invention relates to electroplating and can be used in producing semiconductors. The composition contains at least one copper ion source and at least one additive obtained by reacting a) a compound of a polyatomic alcohol condensate obtained from at least one polyalcohol of formula X(OH)_m (I) via condensation with b) at least one alkylene oxide to produce a polyatomic alcohol condensate containing polyoxyalkylene side chains, where m is an integer from 3 to 6, and X is an m-valent linear or branched aliphatic or cycloaliphatic radical having 2 to 10 carbon atoms, which can be substituted or unsubstituted. The method includes contacting an electrolytic bath containing said composition with a substrate, generating current density in the substrate during a period of time sufficient for depositing a metal coating.

EFFECT: filling nanometre channels and openings substantially without defects.

15 cl, 6 dwg, 6 ex