FIELD: chemistry.
SUBSTANCE: invention relates to electroplating and can be used in producing semiconductors. The composition contains at least one copper source and at least one additive, obtained by reacting a polyatomic alcohol containing at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of a first alkylene oxide and a second alkylene oxide. The method includes contacting the metal coating composition with a substrate, generating current density in the substrate during a time period sufficient to deposit a metal layer on the substrate.
EFFECT: filling nanometre and micrometre openings without voids and seams.
15 cl, 1 tbl, 7 dwg, 8 ex
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