FIELD: chemistry.
SUBSTANCE: invention relates to compositions for electrolytic deposition of copper on semiconductor substrate. Composition contains source of metal ions and at least one additive, containing at least one polyaminoamide of formula I or polyaminoamide derivatives of formula I, obtained by complete or partial protonation, N-quaternisation or acylation.
EFFECT: invention provides essentially flat layer of copper and filling of nano-sized surface elements and micro-scale essentially without formation of defects, in particular cavities when used with electrolytic bath for application of metal coating, particularly to electrolytic bath for application of copper coating.
15 cl, 8 dwg, 1 tbl, 14 ex
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