COMPOSITION FOR METAL ELECTROPLATING COATING CONTAINING LEVELLING AGENT Russian patent published in 2016 - IPC C08L79/04 C25D3/38 C25D3/52 

FIELD: technological processes.

SUBSTANCE: invention relates to compositions for copper electroplating on substrate surfaces of electronic devices. Composition contains a source of copper ions and at least one additive of linear or branched polymer compound of imidazolium of formula (L1), where R¹, R², R³ - hydrogen, R⁴ - bivalent substituted or unsubstituted C₂-C₂₀ alkandiyl, n is an integer from 2 to 6,000.

EFFECT: use of the aid additive (L1) in electrolytic baths for copper electroplating provides higher efficiency of copper layer leveling with achievement of essentially planar layer of copper and filling nanometric and micrometric features of surface without formation of defects, such as cavities.

14 cl, 16 dwg, 10 ex