COMPOSITION FOR ELECTRODEPOSITION OF METAL, CONTAINING LEVELLER Russian patent published in 2016 - IPC C25D3/38 C25D3/02 C25D7/12 C25D5/02 C23C18/31 C08L79/02 C08G73/02 

FIELD: chemistry.

SUBSTANCE: invention relates to composition for electrodeposition of copper, used in the process of production of semiconductors to fill small elements such as through holes and grooves. Composition contains source of copper ions, at least, one additive, containing polyalkyleneimine main chain, wherein polyalkyleneimine main chain has molecular weight Mw from 500 to 100000 g/mol, where N hydrogen atoms in main chain are substituted with polyoxyalkylene radical and where average quantity of oxyalkylene units in said polyoxyalkylene radical constitutes from 1.5 to 10 per N-H unit, one or more intensifying agents, one or more suppressing agents and source of halogenide ions. Application of composition in electrolytic bath for deposition of layers and method for deposition of metal layer on substrate are also described.

EFFECT: achievement of uniform deposition of metal on substrate surface and elimination of defects such as hollows and seams in copper strips.

14 cl, 2 tbl, 17 ex, 10 dwg