PRODUCTION OF DIAMOND-ABRASIVE WIRE Russian patent published in 2015 - IPC B28D1/08 C25D15/00 

FIELD: process engineering.

SUBSTANCE: invention relates to diamond-abrasive tool used for processing super hard and fragile materials, primarily, silicon, sapphire, garnets, quartz, ceramics, glass, etc, particularly, to diamond wire tool. This process comprises isolation of the portion of electrically conducting substrate from electrolyte and galvanic application of diamond-abrasive cutting ply on naked sections of said substrate. said isolation is performed by attachment of non-conducting material composed of discrete ring-like or spiral elements to said substrate and aligning them therewith. After galvanic application of diamond-abrasive cutting ply on naked sections of said substrate said non-conducting material is removed.

EFFECT: longer life, higher processing quality.

2 cl, 6 dwg, 2 ex