FIELD: electricity.
SUBSTANCE: invention relates to electronics and electrical engineering and can be used for providing efficient heat removal from heat emitting components located mainly on single board made, for example, in form of metal sheet or metal printed circuit board. Proposed device comprises metal plate, made with possibility of heat emitting components fixation on it. At that, in metal plate at least one through hole is made forming channel for heat removal in space above metal board. At that, at least one through hole is equipped with tubular ventilation insert, made in lower part by size of through hole in form of nozzle for warm air intake, and in upper part is made by height of not lower than height of heat emitting components placed near it.
EFFECT: higher efficiency of heat removal.
4 cl, 2 dwg
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