FIELD: heat engineering.
SUBSTANCE: invention relates to heat engineering and can be used for providing heat-generating objects with efficient heat removal, for example, from electronic components, installed on one printed-circuit board in electronic module. Achieved by that, device comprises heat receiving element in form of plate from heat-conducting material with outer surface adjacent to heat-generating object, and heat-removing element in form of plate from heat-conducting material with outer surface adjacent to external heat sink, as well as heat-conducting element arranged between plates tightly to their inner surfaces. At that, heat conducting element is made in form of thermal grease layer, plates are made from flexible heat-conducting foil and equipped with through holes with diameter 0.1-2 mm evenly placed on their area, formation of through holes is performed by alternatively piercing heat-conducting foil from its inner and outer sides, and at through holes outputs produced by piercing, forming projections in heat-conducting foil in form of truncated cone with height of 0.1-2 mm and with generatrix inclination angle of 15°-90°.
EFFECT: technical result is increase of heat removal efficiency.
3 cl, 2 dwg
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Authors
Dates
2016-11-20—Published
2015-07-21—Filed