FIELD: heating equipment.
SUBSTANCE: invention relates to heat engineering and can be used to ensure effective removal of heat from heat-generating objects, for example, from electronic components installed on a single printed circuit board in an electronic module. Device for removing heat from heat-generating objects is proposed, which contains a heat-receiving element in the form of a plate made of thermally conductive material with an external surface, the heat-removing element in the form of a plate made of heat-conducting material with an external surface adjacent to the external heat sink, heat-conducting element placed between the plates close to their internal surfaces and made in the form of a layer of thermal paste, as well as a grid installed in the heat-conducting element made in the form of a layer of thermal paste. In this case, the heat-receiving element is made of a material with homogeneous electrochemical properties with the material of the surface of the heat-generating object, the heat-removing element is made of a material with uniform electrochemical properties with the material of the heat-sink surface, and the grid is made of a material having an average value of the electrochemical potential relative to the heat receiving and heat removing elements.
EFFECT: increased efficiency of the heat sink.
6 cl, 1 dwg
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Authors
Dates
2018-11-07—Published
2018-01-17—Filed