FIELD: process engineering.
SUBSTANCE: invention relates to disperse systems that can be active at power feed. Claimed is reactive compound for polymerisation consisting of at least one (A) compound with at least one C-C-mobile bond, solvent (B) or mix thereof wherein component (A) is insoluble and optionally one or several dispersion aids (C) for component (A). Compound (A) is present in (B) as a dispersed solid substance with grain size of 5 nm to 500 mcm. Component (B) comprises solvents selected from the group including distillation fractions containing aromatic matters, hydrocarbonate mixes not containing aromatic matters, ethers, esters, styrene, vinyl toluene, butyl acrylate, butyl metacrylate and mixes thereof. This reactive compound is produced by mixing said components (A), (B) and (C) and their grinding to dispersion. Invention relates also to application of this compound in production of plastics and/or electrical industry for hardening of polymerised compositions, preferably, impregnation and/or filling resin or varnishes, especially for conductors and impregnation varnishes. Besides, they should have lower dangerous potential compared with peroxides. Compositions containing said compound must feature perfected limiting shelf life.
EFFECT: composition not forming the precipitate, polymerises/cross-links unsaturated systems under heat effects.
10 cl, 13 ex
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Authors
Dates
2015-09-10—Published
2010-07-06—Filed