FIELD: chemistry.
SUBSTANCE: process of drying silver-containing paste is carried out in a rarefied atmosphere at pressure of 5.5·103-4.0·104 Pa and air inflow at a rate of 0.5-3 l/min per 1 g silver-containing paste at operating temperature of 100-150°C for 10-60 minutes. Reducing wax content in the sintered silver layer enables to form contact connections in semiconductor power device with improved performance: low electrical resistance, low mechanical stress in the connection and high heat conductivity of the connection.
EFFECT: technology enables to obtain a connection at a low temperature with improved electrical and thermomechanical properties, as well as a longer service life compared to current technologies.
4 cl, 1 tbl
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Authors
Dates
2015-10-10—Published
2014-07-01—Filed