METHOD OF DETERMINING ADHESION STRENGTH OF COATING WITH SILICON SUBSTRATE Russian patent published in 2015 - IPC G01N19/04 

FIELD: chemistry.

SUBSTANCE: coating with an external silver layer is bonded to components of a tearing machine and the coating is torn. A copper layer is additionally deposited on the coating with an external silver layer, followed by heat treatment in a vacuum at temperature of +200-+280°C and holding for 30-60 minutes. The copper layer is bonded to components of the tearing machine. The copper layer is deposited by an electrodeposition method or by high-temperature vacuum evaporation. The copper layer has thickness of 1-2 mcm. The copper layer is bonded to components of the tearing machine using an epoxy resin-based adhesive.

EFFECT: high accuracy of determining adhesion strength of a coating with a silicon substrate by reducing the probability of destruction of the adhesion layer located between the silver coating and the adhesive when testing is carried out on a testing machine.

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