FIELD: process engineering.
SUBSTANCE: claimed process can be used for high-temperature soldering of metal substrate (12) surface (10) with metal oxide passive ply (18). Said surface (10) is activated by sandblasting with powder particles (14) of activating material. Sandblasted metal substrate (12) surface (10) is wetted with filler material (16) at soldering temperature. Said activating material can react with said metal oxide ply (18) at said soldering temperature. Said activating material acts as a catalyst to be split at soldering to two components for destruction or dissolution of substrate metal oxide passive ply.
EFFECT: good flowability of solder and wetting of soldered surface.
8 cl, 4 dwg
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