FIELD: process engineering.
SUBSTANCE: invention relates to soldering of shaped parts (8), particularly, polymer shaped parts, and to method of their soldering together. Claimed device comprises at least one soldering head (1) can be positioned at preset or preset nominal soldering position (6) relative to another soldering head (1, 9) and/or the retainer. Soldering head (1) and/or its part comprises at least one heater to reflow the shaped parts. Heaters such as heating mirror can be positioned and/or can move in spatial field (5) of allowances around the soldering nominal position (6) subject to at least one size departure of at least one part (8) from preset size.
EFFECT: accelerated soldering, decreased required size allowance, lower risks of material changes.
12 cl, 12 dwg
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