FIELD: electricity.
SUBSTANCE: all branches of p-type are located in a single plane, and all branches of n-type - in another parallel plane. Semiconductor branches are made in the form of thin films of different thickness for p- and n-type. Metal soldered joints for contact with semiconductor branches are selected so that in the metal the electrons have lower energy than in the semiconductor. And on the second soldered joint the metal is selected with the energy of electrons, which is higher than in the semiconductor, therefore the result will be similar. Also heat exchange surfaces are used inside the thermoelectric device.
EFFECT: increased efficiency due to reduction of conductive stray losses between hot and cold soldered joints, reduction of stray joule heat emissions and use of contact phenomena between metal soldered joints and semiconductor branches.
1 dwg
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Authors
Dates
2016-02-20—Published
2014-01-14—Filed