FIELD: chemistry.
SUBSTANCE: present invention relates to an aqueous alkaline cleaning composition which is free of organic solvents and silicates, which are free of metal ions, wherein the said composition contains: (A) 0.1-20 wt % L-cysteine, (B) 0.1-20 wt % of at least one quaternary ammonium hydroxide, (C) 0.05-15 wt % of at least one chelating and/or corrosion inhibiting agent selected from a group consisting of aliphatic and cycloaliphatic amines having at least two primary amino groups, (D) 0.001-5 wt % of at least one nonionic surfactant selected from a group of acetylenic alcohols, alkyloxylated acetylenic alcohols and alkyloxylated sorbitol monoesters and a monobasic carboxylic acid. The present invention also relates to a method of treating substrates and to the use of the aqueous alkaline cleaning composition in treating substrates.
EFFECT: producing a composition which more effectively removes all types of residues and dirt formed during the preparation of a substrate surface, electroplating, etching and chemical-mechanical polishing.
12 cl, 1 tbl, 8 ex
