FIELD: heating.
SUBSTANCE: invention relates to heat engineering and can be used for cooling of electronic and microelectronic equipment. Method of cooling electronic and microelectronic equipment is based on use of steam condenser as a film forming unit providing forming of thin wave-free films of liquid with high uniformity and quality.
EFFECT: provision of more intensive, controlled and efficient cooling.
1 cl, 1 dwg
Title | Year | Author | Number |
---|---|---|---|
CONDENSER SEPARATOR FOR TWO-COMPONENT TWO-PHASE SYSTEMS | 2015 |
|
RU2614897C1 |
TWO-PHASE SINGLE-COMPONENT CLOSED COOLING SYSTEM USING FILM-FORMING CAPACITOR | 2023 |
|
RU2818424C1 |
DEVICE FOR INTENSIFYING HEAT EXCHANGE IN LIQUID FILM ENTRAINED BY GAS FLOW BY MEANS OF MICRO-CAVERNS | 2023 |
|
RU2821687C1 |
DEVICE FOR INTENSIFYING HEAT EXCHANGE BY MEANS OF MICRO FRACTURES IN LIQUID FILM | 2023 |
|
RU2820933C1 |
SYSTEM FOR COOLING ELECTRONIC EQUIPMENT WITH MIXTURE OF STEAM AND NON-CONDENSED GAS | 2023 |
|
RU2816279C1 |
TWO-PHASE SINGLE-COMPONENT COOLING SYSTEM | 2023 |
|
RU2807853C1 |
EVAPORATIVE-CONDENSING GAS-LIQUID COOLING SYSTEM FOR ELECTRONIC EQUIPMENT | 2021 |
|
RU2781758C1 |
FLAT EFFICIENT CONDENSER-SEPARATOR FOR MICROGRAVITATION AND TRANSPORT APPLICATIONS | 2016 |
|
RU2640887C1 |
EFFICIENT VAPOUR CONDENSER FOR MICROGRAVITY CONDITIONS | 2015 |
|
RU2635720C2 |
WALL ADJACENT DROPS FLUID FLOWS SHAPER IN MICRO- AND MINI-CHANNELS | 2016 |
|
RU2620732C1 |
Authors
Dates
2016-04-20—Published
2014-12-15—Filed