FIELD: heat engineering.
SUBSTANCE: invention relates to heat engineering and can be used in cooling systems for electronic equipment. In particular, it refers to micro-scale cooling devices. The evaporative-condensing gas-liquid cooling system for electronic equipment includes a flat mini- or microchannel of rectangular cross-section, on the lower wall of which one or more electronic fuel components are located, pumps for supplying a vapor-gas mixture and liquid into the channel, while the system contains an apparatus for ensuring the operation of the cooling system, which is a tank partially filled with liquid, above which there is a vapor-gas space, equipped with an inlet of a vapor-gas mixture and a liquid that has not had time to evaporate on the fuel components in the mini- or a microchannel located in the bottom of the tank so that the vapor-gas bubbles pass through the entire volume filled with liquid, as well as the outlets of the vapor-gas mixture and liquid, while a drip separator, a cooled tubular heat exchanger immersed in liquid and a shielding plate separating the inlet of the vapor-gas mixture and liquid and the outlet of the liquid are installed coaxially with the tank in the vapor-gas space.
EFFECT: increase in the efficiency of the cooling system of electronic components highly stressed by heat flows, increase in its compactness, reduction in metal consumption and cost.
1 cl, 1 dwg
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Authors
Dates
2022-10-17—Published
2021-12-25—Filed