FIELD: heat engineering.
SUBSTANCE: invention relates to heat engineering and can be used in cooling systems of electronic equipment. In two-phase single-component closed cooling system, including substrate (lower wall of channel), flat mini- or microchannel of rectangular cross-section with one or more electronic heat-generating components located on the lower wall of the channel, steam generator, a pump and a film-forming capacitor, which provides the formation of thin, waveless films of liquid of high uniformity, according to the invention, the pump is a liquid pump that supplies condensate to an electrically heated steam generator, system comprises an additional condenser for complete steam condensation, wherein the vapor phase movement in the channel occurs due to the pressure difference in the steam generator and the additional condenser.
EFFECT: increasing the cooling efficiency of electronic components with high thermal stress due to the use of a liquid film moving in a mini- or microchannel under the action of high pressure steam.
1 cl, 1 dwg
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Authors
Dates
2024-05-02—Published
2023-11-29—Filed