SYSTEM FOR COOLING ELECTRONIC EQUIPMENT WITH MIXTURE OF STEAM AND NON-CONDENSED GAS Russian patent published in 2024 - IPC F28C3/06 H01L23/34 

FIELD: power engineering; heat engineering; electronics.

SUBSTANCE: invention relates to power engineering and heat engineering, as well as to the field of electronics, in particular to microscale cooling devices, such as microchannel heat exchangers, which provide high values of heat transfer coefficient at flow of liquids in relatively small volumes. Set task is solved by the fact that in cooling system of electronic equipment with non-condensed gas of optimum concentration, including flat mini- or microchannel of rectangular cross-section, one of walls of which is a substrate for electronic heat-generating components located on it, a steam condenser, pump for steam-gas mixture, according to the invention, the system comprises a valve for discharge and adjustment of concentration of non-condensed gas, which is located at the uppermost point of the system, a standardized high-efficiency compressor performing the functions of a steam-gas mixture pump, high-efficiency plate heat exchanger acting as a steam condenser, a separator combined with a storage tank for liquid and gas phase, wherein the system is double-circuit and closed.

EFFECT: object of the proposed invention is to increase the efficiency of cooling highly heat-stressed electronic components with a possible significant total heat release power of the entire system; removal of significant heat flows requires relatively high consumption of liquid and gas; also, the invention aims at reducing the dimensions and metal consumption of the cooling system.

1 cl, 1 dwg