DEVICE FOR INTENSIFYING HEAT EXCHANGE BY MEANS OF MICRO FRACTURES IN LIQUID FILM Russian patent published in 2024 - IPC F28C3/06 H05K7/20 

FIELD: power engineering; heat engineering.

SUBSTANCE: invention relates to power engineering and heat engineering, as well as to the field of electronics, in particular to microscale cooling devices, such as microchannel heat exchangers, which provide high values of heat transfer coefficient at flow of liquids in relatively small volumes. Such conditions are realized in microelectromechanical systems, integrated electric circuits, laser-diode arrays, high-energy reflectors and other microdevices, subject to short-term or long-term high thermal loads, in devices for cooling electronics, controlling temperature conditions in the aerospace industry; in microelectromechanical devices for biological and chemical research. In the heat exchange intensification device, which includes a flat mini- or microchannel of rectangular cross-section, one of the walls of which is a substrate for electronic heat-releasing elements located on it, wherein cooling takes place due to evaporation of a thin film of liquid entrained by a flow of steam, gas or vapor-gas mixture, according to the invention, the surface of the heat-releasing elements is covered with sinusoidal projections, which are a three-dimensional structure, wherein centres of projections are spaced apart at distance of 400–1,000 mcm while maximum height of said projections varies within range of 100–300 mcm.

EFFECT: increasing the cooling efficiency of electronic components with high thermal stress, which requires significant intensification of heat transfer.

1 cl, 4 dwg