FIELD: electronic equipment.
SUBSTANCE: invention relates to electronic engineering, particularly to production of fixed-value resistors, and it can be used in electronics, radio engineering, and other related industries, including powerful high-frequency circuits. In the method for making thin-film resistor, which involves sputtering of resistive layer and formation of multilayer conductive structure, following deposition of the resistive layer and formation of multilayer conductive structure, a passivating film is formed on the basis of starting component of resistive layer.
EFFECT: technical result of invention consists in improvement of temperature resistance coefficient due to formation of a passivating film on the basis of starting component of resistive layer.
1 cl, 1 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| FILM RESISTOR | 2015 |
|
RU2584032C1 |
| CHIP RESISTOR MANUFACTURING METHOD | 2014 |
|
RU2551905C1 |
| CHIP RESISTOR MANUFACTURING METHOD | 2014 |
|
RU2552630C1 |
| METHOD OF MAKING THIN-FILM PRECISION RESISTOR | 2022 |
|
RU2818204C1 |
| METHOD OF MANUFACTURING A THIN FILM RESISTOR | 2018 |
|
RU2700592C1 |
| COMBINED THIN-FILM RESISTIVE STRUCTURE WITH TEMPERATURE SELF-COMPENSATION | 2022 |
|
RU2808452C1 |
| PROCESS FOR MANUFACTURING MULTILAYER THIN-FILM RESISTORS | 0 |
|
SU1115113A1 |
| THICK-FILM RESISTOR FABRICATION METHOD | 2014 |
|
RU2552631C1 |
| THIN-FILM THERMISTOR MANUFACTURING PROCESS | 1996 |
|
RU2133514C1 |
| METHOD OF MANUFACTURE OF HIGH-TEMPERATURE THIN-FILM RESISTOR | 2007 |
|
RU2326460C1 |
