FIELD: electricity.
SUBSTANCE: in a film resistor comprising a dielectric substrate and made on it multilayer film of resistance materials, located on a heat removal base; the multilayer film of resistance materials includes a resistance layer, an adhesion layer, contact and passivating layers, arranged on the resistance layer, wherein on the said multilayer film protective and marking layers are arranged.
EFFECT: improved temperature coefficient of resistance of film resistors.
1 tbl, 1 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR PRODUCING THIN FILM RESISTOR | 2015 |
|
RU2583952C1 |
METHOD OF MANUFACTURE OF HIGH-TEMPERATURE THIN-FILM RESISTOR | 2007 |
|
RU2326460C1 |
THIN-FILM TITANIUM THERMISTOR ON FLEXIBLE POLYIMIDE SUBSTRATE AND METHOD OF MANUFACTURE THEREOF | 2020 |
|
RU2736233C1 |
PROCESS FOR MANUFACTURING MULTILAYER THIN-FILM RESISTORS | 0 |
|
SU1115113A1 |
METHOD OF MANUFACTURING A THIN FILM RESISTOR | 2018 |
|
RU2700592C1 |
METALLISATION METHOD OF CERAMICS USING METAL-COATED TAPE | 2018 |
|
RU2711239C2 |
METHOD OF MAKING THIN-FILM RESISTOR | 2008 |
|
RU2374710C1 |
CHIP RESISTOR MANUFACTURING METHOD | 2014 |
|
RU2552630C1 |
METHOD FOR MANUFACTURING THIN-FILM RESISTORS | 2000 |
|
RU2207644C2 |
METHOD FOR PRODUCING A MULTILAYER THIN-FILM HETEROSTRUCTURE WITH A GIVEN VALUE OF SPECIFIC SURFACE RESISTANCE | 2020 |
|
RU2750503C1 |
Authors
Dates
2016-05-20—Published
2015-01-26—Filed