METHOD OF MAKING THIN-FILM PRECISION RESISTOR Russian patent published in 2024 - IPC H01C17/75 H01C17/232 C23C14/00 B82Y30/00 

FIELD: electrical engineering.

SUBSTANCE: invention relates to a method of producing precision resistors by thin-film technology, operable in the temperature range from minus 60 to 150 °C, by vacuum deposition of nano- and micro-sized films with formation of layers with negative and positive temperature coefficients (TCR) in a single technological cycle. Technical result is provided by the fact that formation of lower resistive layer is carried out by method of thermal vacuum sublimation of initial components of alloy of nickel Ni and chromium Cr at discharge from 5·10⁻⁷ to 5·10⁻⁵ mm Hg and vacuum deposition of the first layer using an evaporator, to which current of 300 to 400 A is supplied, with preliminary spraying of material on gate for 30–90 seconds, and adjustment of current value to values providing uniform boiling of alloy, which ensures sputtering of layer with positive sign of TCR, after which formation of upper layer is carried out by method of explosive evaporation from tape tungsten evaporator of cermets K-20C, K-30C and K-50C, which are resistive alloy PC-4,800/glass C44-1 in form of dispersed powder, at discharge from 5·10⁻⁷ to 5·10⁻⁵ mm Hg, and currents in range of 420...550 A, which provides formation of the second layer with a negative sign of TCR. To stabilize the output parameters of the obtained two-layer thin-film resistors, thermal cycling in a vacuum, thermal annealing in an air atmosphere and aging are additionally performed.

EFFECT: improved operational characteristics of resistors due to minimization of TCR and stabilization of parameters.

5 cl, 2 dwg, 2 tbl, 1 ex